Semiconductor
Display
Vacuum system
Heating system
Display
Process equipment for eliminating the Chipping and Crack that occurrence from Scriber process for cutting Glass and Process equipment for eliminating the Shorting Bar of TFT Panel.
Feature
- Precise GRINDING technology by using the Vision Align technology
- Automatic GRINDING technology by using the real-time inspection technology
- Auto Recipe Change Function by using the VARIABLE Table
- HIGH SPEED GRINDING TECHNOLOGY by using the precise processing (Max : 500mm/sec)
- Provide necessary Data and convenient UI component for product management
Specifications
- Chipping Size : ≤ 50um
- Applied process : Plane, Corner(R-Cut, C-Cut)
- Target : LCD, OLED, LTPS