Semiconductor
Display
Vacuum system
Heating system
Semiconductor
After wafer CMP process, this system is used to remove the surface and back of the wafer with the use of a brush and cleansing solution.
Feature
- Single Wet Cleaner for Post CMP
– Spin Dry after the removal of impurities by PVA brush
- Customized components
– Various kinds of components (e.g., 2 brushing chambers + 2 Spin Dry chambers)
– A variety of options, such as Megasonic and Spray
Specifications
- Chamber quantity : selected by a customer
- Process : Post CMP Cleaning
- Wafer size : 200mm, 300mm (Making a special type of wafer is available.)